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Bone Level - UFIII

Internal Hex Connection’s Submerged Implant System

Key Design Features

Fully Tapered Body

The fully tapered design provides excellent insertion stability and feel.

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Extra Diameter

Provides stable fixation, even in soft bone and maxillary sinus cases.

Power Cutting Edge

Its longer, sharpened cutting edge facilitates self-tapping, even in under-drilled osteotomies.

Wide Thread Pitch

The thread pitch spacing and depth are designed to maximize the BIC effect.

DIO Implant UFIII.

UFIII Features

Enhanced Initial Stability with Specialized Design for Soft Bone

Powerful Design

Enhanced stability through overall tapered shape and larger cutting edge design optimized for soft bone conditions.

Various Indications

Maxillary sinus lift, immediate extraction and placement, edentulism, and challenging bone quality scenarios.

Shortened Protocol

Reduced drilling steps up to 4 stages in soft bone. Easy self-tapping even during under-drilling procedures.

Surface Treatment

Hybrid Type

The upper part features a fine roughness to prevent peri-implantitis, while the body and apex areas employ the most suitable surface roughness for osseointegration.

UFIII Implant with sections zoomed.

Size Chart

Hex 1.7

UFIII Narrow

Hex 2.5

UFIII Regular

Size Chart

UF II Narrow

Size Chart

UF III Regular

DIO NAVI Master S Kit

A dedicated DIO NAVI kit for UFII/UFIII fixtures (Ø3.8–Ø5.0), designed for guided implant procedures. Based on a standard 9.0 mm offset with Guide Sleeve: GS 53BL.

Composition